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ALL CONSUMER ROADS CROSS
IN ICCE BERLIN!

ICCE-Berlin 2017 has received approval for a Journal Special Issue, IEEE Consumer Electronics Magazine (impact factor 1.153),
a selected high quality papers will be considered for possible publication in this.
Lightning talks in book chapters!

3 SEP - 6 SEP 2017, BERLIN

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KEYNOTE SPEAKERS



LEARN MORE

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Call for Participation:
“CESocTV: Be famous!”

ICCE-Berlin Best Poster/Paper Video presentation Award:
One minute is all it takes, and your project could be the talk of the IEEE ICCE-Berlin 2017!

MORE DETAILS

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Get Connected at ICCE Berlin 2017

All participants of ICCE Berlin 2017 are invited to download the B2B MeetUp mobile application and use it during the event. This free APP will connect you with other participants at the conference’s sessions, greatly enhancing your experience by creating unique opportunities to meet up, share expertise, experiences, and create future collaborations.

B2B MeetUp works in real-time, scanning continuously with profile matching to find people of interest to meet nearby whilst attending the ICCE Berlin 2017. At the touch of a button, you can request to meet face-to-face, and open the door to new working relationships. Click here to watch the video



7th IEEE International conference on consumer electronics

All consumer roads intersect in ICCE Berlin!

dear friends!

We cordially invite you for the 7th time to be part of the International Conference of Consumer Electronics in Berlin (“ICCE-Berlin”), during and at IFA fair ground, the leading trade show for Consumer Electronics and Home Appliances.

The Place Where Visions Start, the Place Where Visions Materialize!

The ICCE-Berlin is the European sister conference of the IEEE Consumer Electronics Society’s flagship conference “ICCE” held annually in Las Vegas in conjunction with the Consumer Electronics Show (CES). Berlin, a birthplace of consumer electronics, is one of Europe’s most exciting cultural centres and a vibrant city. The conference will bring again together researchers and engineers from industry, research centres, and academia to exchange information and results of recent work on systems, circuits, technologies, processes, and applications. It will provide an excellent forum for the researchers, system developers, and service providers to share their ideas, designs and experiences in such a proper environment as the IFA. We have some of the world’s leading experts giving keynote speeches, and also high quality tutorials as well as panel discussions.

We invite you to be a part of this diverse community, to be at the source of future trends and to brainstorm, network, and help visions hit the road to reality!

This year again the IEEE CE Society is joining forces with other IEEE societies to broaden and strengthen the CE subjects and scope of the conference. The conference will continue tradition of the the world’s leading experts giving keynote speeches, high quality tutorials, panel discussions, workshops, and products and prototype demonstration, social events and fun. We are preparing a galore of surprises, which we will gradually reveal as the date draws closer, so bookmark this page and visit often.

Eagerly waiting to see you again or meet you for the first time.

Best,

The ICCE BERLIN 2017 Organizing Team



Main sessions - core topics

Boundaries between disciplines are breached and CE is a perfect example of multidisciplinary, interdisciplinary, and cross-technology work in action. The seed starts in fundamental sciences, nurtured via tools, management, units and empowered by services and systems, tailored by needs and desires, until it matures to off the shelf products. In this light topics include, but are not limited to the following:

Q: How do I know that my submission is with the scope of the ICCE BERLIN?

A: If you can write a paragraph with a consumer in mind – then yes, by all means, you are at the right place!

SPECIAL SESSIONS

AI & ML Robotics Challenges

eHealth Journals HACKATON

INFORMATION FOR AUTHORS

Prospective authors are invited to participate in any or all of the following categories:

      1. Papers - submit either a 2 page extended abstract, or up to 6 page paper. All accepted papers must comply with IEEE format specifications and signed IEEE copyright form, to be submited to IEEE Xplore database.
      2. Tutorials - submit your biography and content with short description.
      3. Lightning talks -a short description or 5 slides long ppt file.

ICCE BERLIN venue: IFA, Berlin Messe

When: 3 - 6 September 2017.

Only electronic submissions via the web will be accepted.

Hard deadline: June 4th 2017. June 18th 2017.

Notification of acceptance: four weeks after submission.

Registration info Click here to Participate .

important dates

registration
opens
10 January 2017
submission
deadline
18 June 2017

Team

Gordana Velikic, General Chair
Stefan Mozar, general Co-Chair
Dietmar Hepper, Graphics, Advisor
Milan Bjelica, TPC Chair
Wolfgang Endemann, TPC Co-Chair
Kousik Sankar, TPC Co-Chair
José Mª Flores, TPC Co-Chair
Sharon Peng, President IEEE CE Society
Stephen Dukes, IEEE CE Society VP of Conferences
Konstantin Glasman, Publicity Chair
Ralf Schäfer, VDE Chair
Tom Wilson, Past Chair/Advisor
Francisco Bellido, Sponsorship Chair
Abdullah Almuttiri, Young Professionals Chair
Charlotte Kobert, Conference Coordinator
Maria-Iuliana Dascalu, Advisor/East Europe Publicity Co-Chair
Vera Teslic, Publicity Chair
Frank Sabath , Electro Magnetic Compatibility Society
John Allen
Christian Hansen, Reliability Society
Lucio Ciabattoni - Publication Chair
Carolyn McGregor
Nemanja Lukic, Publicity Chair, local
Niclas Koch - student activities chair, local
Supavadee Aramvith, Asia Activities Chair
Narisa Chu, Hackaton Chair
Carsten Dolar, Local Chair

Samad Ahmadi, GB
Cecelia Horwitz, US
Floyd Tucker, US
Francisco Bellido, ES
Robin Bradbeer, HK
Karlheinz Brandenburg, DE
Teodor Buburuzan, DE
Peter Corcoran, IE
Tom Coughlin, US
Steve Diamond, US
Daniel Díaz Sánchez, ES
Stephen Dukes, US
Wai-Chi Fang, TW
Jim Farmer, US
Bob Frankston, US
Nahum Gershon, US
Konstantin Glasman, RU
Tomohiro Hase, JP
Christian Hentschel, DE
Thorsten Herfet, DE
Alexander Huhn, DE
Kees Immink, NL
Wen-Chung Kao, TW
Sung-Jea Ko, KR
Uwe E. Kraus, DE
Scott Linfoot, UK
Gordana Velikic, RS
Reinhard Möller, DE
António Navarro, PT
Takako Nonaka, JP
Sharon Peng, US
Fernando Pescador, ES
Ulrich Reimers, DE
Ulrich Reiter, NO
Klaus Ruelberg, DE
Jorge Sampaio, BR
Ralf Schäfer, DE
Raimondo Schettini, IT
Horst Schwetlick, DE
Mohammad Sharawi, SA
Pierluigi Siano, IT
Nicholas Vun, SG
Hans L. Cycon, DE
Yu Yuan, US, CN
Shingo Yamaguchi, JP
Joseph Wei, USA
William Decker, USA
Rudi Schubert, USA
Supavadee Aramvith, TH
Carsten Dolar, DE
Jpe Decur, USA
Matt Swatzell, USA
Wen-Chung Kao, TW
Randi Sumner, USA

Laith Al-Jobouri, University of Essex, United Kingdom (Great Britain)
John Allen, Product Safety Consulting, Inc., USA
Boon Chong Ang, Intel, Malaysia
Marija Antic, RT-RK, Serbia
Theodore Antonakopoulos University of Patras, Greece
Djamila Aouada, University of Luxembourg, Luxembourg
Ezendu Ariwa, University of Bedfordshire, United Kingdom (Great Britain)
Anant Baijal, Samsung Electronics, Korea
Jorge Rodolfo Beingolea Garay, University of Sao Paulo, Brazil
Francisco Bellido Outeiriño, University of Córdoba, Spain
Simone Bianco, University of Milano Bicocca, Italy
Milan Bjelica, University of Novi Sad, Serbia
Holger Blume, Leibniz Universitaet, Hannover, Germany
Robin Bradbeer, Pearl Technologies Ltd, Hong Kong
Concettina Buccella , University of L'Aquila, Italy
John Buford, Koopid Inc, USA
Yao-Tang Chang, Kao Yuan University, Taiwan
Pai Chou, University of California, Irvine, USA
Lucio Ciabattoni, Universita' Politecnica delle Marche, Italy
Enea Cippitelli, Università Politecnica delle Marche, Italy
Thomas Coughlin, Coughlin Associates, USA
Claudio Cusano, University of Pavia, Italy
Hans Cycon, HTW Berlin, Germany
Soumya Kanti Datta, EURECOM, France
Daniel Díaz-Sánchez, Universidad Carlos III de Madrid, Spain
Miodrag Djukic, Faculty of Technical Sciences, Serbia
Carsten Dolar, Robert Bosch GmbH, Germany
Wolfgang Endemann, Dortmund University of Technology, Germany
Jose-Maria Flores-Arias, University of Cordoba, Spain
Exell Enrique Franklin Jiménez, IEEE, Colombia
Bob Frankston, Frankston, USA
Petra Friedrich, Hochschule Kempten, University of Applied Sciences, Germany
Ennio Gambi, Università Politecnica delle Marche, Italy
Konstantin Glasman, St. Petersburg State University of Film and Television, Russia
Eugenie Grinenko, Staint Petersburg State University of Film and Television, Russia
Yeong-Ho Ha, Kyungpook National University, Korea
Dong Seog Han, Kyungpook National University, Korea
HeeChul Han, Samsung Electronics, Korea
Eisuke Hanada, Saga University, Japan
Christian Hentschel, Brandenburg University of Technology Cottbus-Senftenberg, Germany
Dietmar Hepper, ex Technicolor, Germany
Thorsten Herfet, Saarland University, Germany
Chen-Chien Hsu, National Taiwan Normal University, Taiwan
Ivan Kastelan, University of Novi Sad, Faculty of Technical Sciences, Serbia
Mladen Knezic, University of Banja Luka, Bosnia and Herzegovina
Franz Korf, Hamburg University of Applied Sciences, Germany
Uwe Kraus, University of Wuppertal, Germany
Goo-Rak Kwon, Chosun University, Korea
Krsto Lazic, Faculty of Technical Sciences, Serbia
Fritz Lebowsky, STMicroelectronics, France
Wu-Ja Lin, National Formosa University, Taiwan
Zeljko Lukac, RT-RK Computer Based Systems LLC, Serbia
Charlotte Magnusson, Lund University, Sweden
Alexey Melezhik, Gazprom Promgaz, Russia
Reinhard Moeller, University of Wuppertal, Germany
Stefan Mozar, Dynexsys Pty Ltd, Sydney, Australia
Antonio Navarro, University of Aveiro, Portugal
Peter Neumann, CBC, Germany
Istvan Papp, University of Novi Sad, Serbia
Bogdan Pavkovic, RT-RK, Novi Sad, Serbia
Thinagaran Perumal, University Putra Malaysia ,Malaysia
Fernando Pescador, Universidad Politécnica de Madrid, Spain
Goran Petrovic, Saarland University, Germany
Nebojsa Pjevalica, University of Novi Sad, Serbia
Eduardo Quevedo, Oceanic Platform of the Canary Islands, Spain
Boris Radin, Faculty of Technical Sciences, University of Novi Sad, Serbia
Gulistan Raja, University of Engineering & Technology, Taxila, Pakistan
Rafael Real-Calvo, University of Cordoba, Spain
Ulrich Reimers, Technische Universitaet Braunschweig, Germany
Julia Richter, Chemnitz University of Technology, Germany
Frank Sabath, WIS, Germany
Ramiro Samano-Robles, Research Centre in Real Time and Embedded Systems, Portugal
Kousik Sankar, Larsen & Toubro Technological Services (LTTS), India
Raimondo Schettini, University of Milano Bicocca, Italy
Hui-liang Shen, Zhejiang University, P.R. China
Yongtao Shuai, Saarland University, Germany
Pierluigi Siano, University of Salerno, Italy
Susanna Spinsante, Università Politecnica delle Marche, Italy
Ioan Tache, University Politehnica Bucuresti, Romania
Nikola Teslic, University of Novi Sad, Serbia
Dmitry Vavilov, T-Systems RUS, Russia
Ivan Velikic, RT-RK, Serbia
Mario Vranjes, University of Osijek, Faculty of Electrical Engineering, Computer Science and Information Technology, Croatia
Vladan Zdravkovic, Sheffield Hallam University, United Kingdom (Great Britain)
Marcelo Zuffo, University of São Paulo, Brazil

Gordana Velikic
Vera Teslic
Konstantin Glasman
Francisco Bellido
Natasa Vukota
Marko Bodiroza
Bojan Kosic






Keynote Speakers: Creative Discussions


Patronage packages

You are invited to participate and become a patron of the 2017 International Conference of Consumer Electronics in Berlin (ICCE-Berlin) to be held at the IFA fairground like previous editions. The conference will feature outstanding keynote speakers, workshops, industry sessions and peer-reviewed papers. Because it runs in parallel with IFA and is held inside IFA ground, it attracts a global mix of industry and academic participants and is an excellent opportunity to promote your company/organization to an audience of world-class researchers in the CE industry.

To take advantage of this opportunity, please refer to the details on the pages below for various patron packages. We are looking forward to welcoming you in Berlin! If you have any questions, or would like us to customize a package just for your company, please contact Charlotte Kobert (Conference Coordinator) at ckobert@ieee.org, Jelena Gajić (Technical Sponsorship Coordinator) at jelena.gajic@rt-rk.com, or Gordana Velikić (General Chair) at gordana.velikic@rt-rk.com.

MORE DETAILS (PDF)

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