ALL CONSUMER ROADS CROSS
IN ICCE BERLIN!
2 SEP - 5 SEP 2018, BERLIN
ALL CONSUMER ROADS CROSS
IN ICCE BERLIN!
2 SEP - 5 SEP 2018, BERLIN
We cordially invite you for the 8th time to be part of the International Conference of Consumer Electronics in Berlin ( “ICCE-Berlin”), during and at IFA fair ground, the leading trade show for Consumer Electronics and Home Appliances.
The ICCE-Berlin is the European sister conference of the IEEE Consumer Electronics Society’s flagship conference “ICCE” held annually in Las Vegas in conjunction with the Consumer Electronics Show (CES). Berlin, a birthplace of consumer electronics, is one of Europe’s most exciting cultural centres and a vibrant city. The conference will bring again together researchers and engineers from industry, research centres, and academia to exchange information and results of recent work on systems, circuits, technologies, processes, and applications. It will provide an excellent forum for the researchers, system developers, and service providers to share their ideas, designs and experiences in such a proper environment as the IFA. We have some of the world’s leading experts giving keynote speeches, and also high quality tutorials as well as panel discussions.
We invite you to be a part of this diverse community, to be at the source of future trends and to brainstorm, network, and help visions hit the road to reality!
This year again the IEEE CE Society is joining forces with other IEEE societies to broaden and strengthen the CE subjects and scope of the conference. The conference will continue tradition of the the world’s leading experts giving keynote speeches, high quality tutorials, panel discussions, workshops, and products and prototype demonstration, social events and fun. We are preparing a galore of surprises, which we will gradually reveal as the date draws closer, so bookmark this page and visit often.
Eagerly waiting to see you again or meet you for the first time.
Best,
The ICCE BERLIN 2018 Organizing Team
Boundaries between disciplines are breached and CE is a perfect example of multidisciplinary, interdisciplinary, and cross-technology work in action. The seed starts in fundamental sciences, nurtured via tools, management, units and empowered by services and systems, tailored by needs and desires, until it matures to off the shelf products. In this light topics include, but are not limited to the following:
1) Security and Privacy of CE Hardware and Software Systems (SPC)
2) Energy Management of CE Hardware and Software Systems (EMC)
3) Application-Specific CE for Smart Cities (SMC)
4) RF, Wireless, and Network Technologies (WNT)
5) Internet of Things and Internet of Everywhere (IoT)
6) Entertainment, Gaming, and Virtual and Augmented Reality (EGV)
7) AV Systems, Image and Video, and Cameras and Acquisition (AVS)
8) Automotive CE Applications (CEA)
9) CE Sensors and MEMS (CSM)
10) Consumer Healthcare Systems (CHS)
11) Enabling and HCI Technologies (HCI)
12) Smartphone and Mobile Device Technologies (MDT)
13) Artificial Intelligence (AI) and Deep Learning (DL) Applications in CE
Prospective authors are invited to participate in any or all of the following categories:
ICCE BERLIN venue: IFA, Berlin Messe
When: 2 - 5 September 2018.
Only electronic submissions via the web will be accepted.
Hard deadline:
May 21st 2018. June 18th 2018.
Notification of acceptance: four weeks after submission.
General Conference Chair
Reinhard Moeller (DE)
University of Wuppertal
Technical Program Chair
Lucio Ciabattoni (IT)
Università Politecnica delle Marche
President, Consumer Electronics Soc.
Sharon Peng (USA)
VP of CE Conferences
Stephen Dukes (USA)
Co-Organizng Chairs and Officers:
Wolfgang Endemann (DE), TP Co-Chair
Gordana Velikic (SRB), 2017 Past Chair
Uwe Kraus (DE), Publications
Konstantin Glasman (RU), Film and Video
Production
Alexander Huhn (DE), Local Chair
Stefanie Trott (DE), Student Activities
Shingo Yamaguchi (JP), Young Professionals
Lee Stogner (USA), Marketing and Social Media
Kousik Sankar, Asia Liaison
Christian Gross, VDE/ITG Liaison
Carsten Dolar, Bosch (DE), Treasurer
Peter Corcoran (IRL)
Tom G B Wilson (CAN)
Stefan Mozar (AUS)
Simon Sherratt (UK)
Francisco Bellido (ES)
Dietmar Hepper (DE)
Tom Coughlin (USA
Conference Coordinator/ Web Chair
Charlotte Kobert, Pittsburgh, PA
icce@ieee.org
Laith Al-Jobouri, University of Essex, United Kingdom (Great Britain)
John Allen, Product Safety Consulting, Inc., USA
Boon Chong Ang, Intel, Malaysia
Marija Antic, RT-RK, Serbia
Theodore Antonakopoulos University of Patras, Greece
Djamila Aouada, University of Luxembourg, Luxembourg
Ezendu Ariwa, University of Bedfordshire, United Kingdom (Great Britain)
Anant Baijal, Samsung Electronics, Korea
Jorge Rodolfo Beingolea Garay, University of Sao Paulo, Brazil
Francisco Bellido Outeiriño, University of Córdoba, Spain
Simone Bianco, University of Milano Bicocca, Italy
Milan Bjelica, University of Novi Sad, Serbia
Holger Blume, Leibniz Universitaet, Hannover, Germany
Robin Bradbeer, Pearl Technologies Ltd, Hong Kong
Concettina Buccella , University of L'Aquila, Italy
John Buford, Koopid Inc, USA
Yao-Tang Chang, Kao Yuan University, Taiwan
Pai Chou, University of California, Irvine, USA
Lucio Ciabattoni, Universita' Politecnica delle Marche, Italy
Enea Cippitelli, Università Politecnica delle Marche, Italy
Thomas Coughlin, Coughlin Associates, USA
Claudio Cusano, University of Pavia, Italy
Hans Cycon, HTW Berlin, Germany
Soumya Kanti Datta, EURECOM, France
Daniel Díaz-Sánchez, Universidad Carlos III de Madrid, Spain
Miodrag Djukic, Faculty of Technical Sciences, Serbia
Carsten Dolar, Robert Bosch GmbH, Germany
Wolfgang Endemann, Dortmund University of Technology, Germany
Jose-Maria Flores-Arias, University of Cordoba, Spain
Exell Enrique Franklin Jiménez, IEEE, Colombia
Bob Frankston, Frankston, USA
Petra Friedrich, Hochschule Kempten, University of Applied Sciences, Germany
Andrea Monteriù, Università Politecnica delle Marche, Italy
Ennio Gambi, Università Politecnica delle Marche, Italy
Konstantin Glasman, St. Petersburg State University of Film and Television, Russia
Eugenie Grinenko, Staint Petersburg State University of Film and Television, Russia
Yeong-Ho Ha, Kyungpook National University, Korea
Dong Seog Han, Kyungpook National University, Korea
HeeChul Han, Samsung Electronics, Korea
Eisuke Hanada, Saga University, Japan
Christian Hentschel, Brandenburg University of Technology Cottbus-Senftenberg, Germany
Dietmar Hepper, ex Technicolor, Germany
Thorsten Herfet, Saarland University, Germany
Chen-Chien Hsu, National Taiwan Normal University, Taiwan
Ivan Kastelan, University of Novi Sad, Faculty of Technical Sciences, Serbia
Mladen Knezic, University of Banja Luka, Bosnia and Herzegovina
Franz Korf, Hamburg University of Applied Sciences, Germany
Uwe Kraus, University of Wuppertal, Germany
Goo-Rak Kwon, Chosun University, Korea
Krsto Lazic, Faculty of Technical Sciences, Serbia
Fritz Lebowsky, STMicroelectronics, France
Wu-Ja Lin, National Formosa University, Taiwan
Zeljko Lukac, RT-RK Computer Based Systems LLC, Serbia
Charlotte Magnusson, Lund University, Sweden
Alexey Melezhik, Gazprom Promgaz, Russia
Reinhard Moeller, University of Wuppertal, Germany
Stefan Mozar, Dynexsys Pty Ltd, Sydney, Australia
Antonio Navarro, University of Aveiro, Portugal
Peter Neumann, CBC, Germany
Istvan Papp, University of Novi Sad, Serbia
Bogdan Pavkovic, RT-RK, Novi Sad, Serbia
Thinagaran Perumal, University Putra Malaysia ,Malaysia
Fernando Pescador, Universidad Politécnica de Madrid, Spain
Goran Petrovic, Saarland University, Germany
Nebojsa Pjevalica, University of Novi Sad, Serbia
Eduardo Quevedo, Oceanic Platform of the Canary Islands, Spain
Boris Radin, Faculty of Technical Sciences, University of Novi Sad, Serbia
Gulistan Raja, University of Engineering & Technology, Taxila, Pakistan
Rafael Real-Calvo, University of Cordoba, Spain
Ulrich Reimers, Technische Universitaet Braunschweig, Germany
Julia Richter, Chemnitz University of Technology, Germany
Frank Sabath, WIS, Germany
Ramiro Samano-Robles, Research Centre in Real Time and Embedded Systems, Portugal
Kousik Sankar, Larsen & Toubro Technological Services (LTTS), India
Raimondo Schettini, University of Milano Bicocca, Italy
Hui-liang Shen, Zhejiang University, P.R. China
Yongtao Shuai, Saarland University, Germany
Pierluigi Siano, University of Salerno, Italy
Susanna Spinsante, Università Politecnica delle Marche, Italy
Ioan Tache, University Politehnica Bucuresti, Romania
Nikola Teslic, University of Novi Sad, Serbia
Dmitry Vavilov, T-Systems RUS, Russia
Ivan Velikic, RT-RK, Serbia
Mario Vranjes, University of Osijek, Faculty of Electrical Engineering, Computer Science and Information
Technology, Croatia
Vladan Zdravkovic, Sheffield Hallam University, United Kingdom (Great Britain)
Marcelo Zuffo, University of São Paulo, Brazil
